| PART |
Description |
Maker |
| BL0952 |
BL0952
|
上海贝岭股份有限公司
|
| BL0952 |
BL0952
|
SHANGHAI BELLING CO., LTD.
|
| 0740621014 |
2.00mm (.079) Pitch VHDM? Board-to-Board Backplane Header, Vertical, 8-RowGuide Pin Signal Module, Shield End Version, Pin End Version, 80 Circuits, Pin Length
MOLEX Connector
|
Molex Electronics Ltd.
|
| 0740591024 74059-1024 |
2.00mm (.079) Pitch VHDM? Board-to-Board Backplane Header, Vertical, 6-Row,Guide Pin Signal Module, Shield End Version, Pin End Version, 60 Circuits, Pin Length 5.15mm (.203)
2.00mm (.079") Pitch VHDM庐 Board-to-Board Backplane Header, Vertical, 6-Row,Guide Pin Signal Module, Shield End Version, Pin End Version, 60 Circuits, Pin Lengt
MOLEX Connector
|
Molex Electronics Ltd.
|
| KM48L16031BT-GF0 KM48L16031BT-GFY KM48L16031BT-GFZ |
128 Mb DDR SDRAM. Version 0.61, Operating freq. 100 MHz, speed 10ns.
DDR SDRAM Specification Version 0.61
128Mb DDR SDRAM
128 Mb DDR SDRAM. Version 0.61, Operating freq. 133 MHz, speed 7.5 ns.
|
SAMSUNG[Samsung semiconductor]
Samsung Electronic
|
| 0740591023 74059-1023 |
2.00mm (.079) Pitch VHDM? Board-to-Board Backplane Header, Vertical, 6-RowGuide Pin Signal Module, Shield End Version, Pin End Version, 60 Circuits, Pin Length
2.00mm (.079") Pitch VHDM庐 Board-to-Board Backplane Header, Vertical, 6-RowGuide Pin Signal Module, Shield End Version, Pin End Version, 60 Circuits, Pin Length
MOLEX Connector
|
Molex Electronics Ltd.
|
| 74059-2503 0740592503 |
2.00mm (.079") Pitch VHDM庐 Board-to-Board Backplane Header, Vertical, 6-Row,Guide Pin Signal Module, Shield End Version, Pin End Version, 150 Circuits, Pin
2.00mm (.079) Pitch VHDM? Board-to-Board Backplane Header, Vertical, 6-Row,Guide Pin Signal Module, Shield End Version, Pin End Version, 150 Circuits, Pin
|
Molex Electronics Ltd.
http://
|
| U3666M U3666M-MFP U3666M-MDP |
Baseband Delay Line o.o64 ms (Improved Version of U3665M)
Baseband Delay Line 64 xs (Improved Version of U3665M)
Baseband Delay Line 64 us (Improved Version of U3665M)
|
Atmel
TEMIC[TEMIC Semiconductors]
|
| W83877ATF W83877ATD |
enhanced version from Winbonds most popular I/O chip W83877F
enhanced version from Winbonds most popular I/O chip W83877F
|
Winbond Electronics Corp
|
| AT71200M AT71200MCRER AT71200MCRERB AT71200MCRHR |
AT71200M Monochrome [Updated 2/03. 23 Pages] Full field CCD. 3500 x 2300 pixels. 4 x 25 MHz
Full field image sensor 3500 x 2300 pixels, 4 x 25 MHz
8M-pixel color image sensor. Full frame version standard image grade. Anti-reflective window.
8M-pixel color image sensor. Frame transfer version with two memories zones. Anti-reflective window.
8M-pixel color image sensor. Full frame version high image grade. Anti-reflective window.
|
Atmel
|
| O28.0-JAS32P4-12-30 O28.0-JAS32P4-12-50 JAS32P4 |
4 Pad Version
|
Jauch Quartz Gmbh
|
|
